SurfaceWave technology
The Semilab AMS SW-3300 uses the exclusive SurfaceWave™ technology to measure the thickness and uniformity of thin film metals and dielectrics. It’s a low cost but powerful product built expressly for copper, low k materials.

The 3300 delivers high-throughput, non-contact, non-destructive measurements of the thickness and uniformity of metal line arrays and pads for all copper/low-k processes. The 3300 is capable of incredible speed and accuracy at the 65 nm node and lower for maximum scalability and the lowest cost of ownership in its class.